Ultra Thin and Precision Diamond Wheels are widely used for cutting, dicing and slicing of nonmetal
materials, such as semiconductor materials, PCB, tungsten carbide, glass, ceramics, quartz, crystal, magnetic materials etc.
Ultra thin & precision CBN wheels are used for cutting and slotting of metallic materials, such as high speed steels, tool steels, mold steels, alloy steels etc.
Metal sintered ultra thin and precision diamond blades are specially of strong-hold grains, good rigidity and excellent wearability.They are used in cutting and grooving of electronic, optical, ceramic, semiconductor materials etc.
Compared with metal bonded wheels, ultra thin and precision resin bonded diamond blades are more aggressive, more elastic and have a strong self-sharpening ability.
These wheels are designed for high efficient cutting and processing of harder and fragiler materials such as glass, quartz, ceramics, etc.
This product is electroformed with excellent cutting ability and high efficiency.
For dicing and slitting of materials such as semiconductors, electronic components, ceramics, CPS etc.
The diamond blade with hub has a stronger edge, which makes the blade more rigid and keeps the edge from damage.
High efficiency cutting especially for dicing of Si-wafers.
Thickness: 0.015~0.140 mm
Electroformed Bond
Different concentration and hardness available
Grit: 600#~4800#
The Wafer back & front diamond wheel is mainly used for the thinning and finishing of silicon wafers and other compound semiconductor wafers.
These wheels are produced with resin and vitrified bonds and feature free cutting, wear resistance, good shape maintainebility and long durability.
Compatible machines: DISCO, OKAMOTO, TSK, STRASBAUGH and more.